Light emitting device having wide beam angle and method of fabricating the same

ABSTRACT

A light emitting device including a light emitting structure disposed on one surface of a substrate and a transflective portion disposed on the other surface of the substrate. The transflective portion and the substrate have different indexes of refraction from one another.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. patent application Ser. No.14/807,290, filed on Jul. 23, 2015, which is a Divisional of U.S. patentapplication Ser. No. 14/496,895, filed on Sep. 25, 2014, now U.S. Pat.No. 9,123,866, and claims priority from and the benefit of Korean PatentApplication No. 10-2013-0114735 and Korean Patent Application No.10-2013-0116630, filed on Sep. 26, 2013, and Sep. 30, 2013,respectively, all of which are hereby incorporated by reference for allpurposes as if fully set forth herein.

BACKGROUND

1. Field

Exemplary embodiments of the present invention relate to a technologyfor a light emitting device and a method of fabricating the same,including a light emitting device having a wide beam angle by virtue ofsurface treatment and the like, and a method of fabricating the same.

2. Discussion of the Background

Light emitting devices are inorganic semiconductor devices emittinglight generated by recombination of electrons and holes, and are used ina variety of fields such as displays, vehicle lamps, general lightingdevices, and the like. Since nitride semiconductors, such as a galliumnitride semiconductor and a gallium aluminum semiconductor, may be of adirect transition type and may be fabricated to have various energy bandgaps, the nitride semiconductors may be used to fabricate light emittingdevices having various wavelength emission ranges as needed.

Light emitting devices are required to have various ranges of beamangles depending upon applications thereof. For example, it isadvantageous that UV light emitting devices applied to backlight unitsof displays, sterilizers, and the like have wide beam angles. Therefore,additional components such as a lens, or a technique such as surfacetreatment are used to increase beam angles of the light emittingdevices.

For wafer level packages having no separate package body, orchip-on-board type light emitting devices, it is necessary to adjustbeam angles thereof without an additional component, such as a lens.However, although typical surface processing techniques can increaselight extraction efficiency of light emitting devices, there isdifficulty in increasing the beam angles thereof. Particularly, since itis undesirable that an injection-molded component or lens made of amaterial, which can be deformed or degraded by UV light, be applied toUV light emitting devices, there is a limit in application of techniquesfor increasing beam angles.

In addition, typical flip chip type light emitting devices have aproblem in that even a sapphire substrate having a thickness of 400 μmor greater has difficulty in realizing a wide beam angle of 140° ormore, and that, as the thickness of the sapphire substrate increases,luminous efficiency decreases.

Therefore, there is a need for techniques for increasing a beam angle ofa light emitting device not employing a package body or a lens.

SUMMARY

Exemplary embodiments of the present invention provide light emittingdevices having a wide beam angle and methods of fabricating the same.

Exemplary embodiments also provide a light emitting device having a widebeam angle without the need for an additional component such as a lens,and a method of fabricating the same.

Exemplary embodiments also provide a light emitting device whichincludes a thin sapphire substrate and a transflective layer formed onthe sapphire substrate to minimize light loss so as to improve luminousefficiency while achieving a wide beam angle of 140° or more.

Additional features of the invention will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention.

An exemplary embodiment of the present invention discloses a lightemitting device including: a light emitting structure; a substratedisposed on the light emitting structure; and an anti-reflection layercovering side surfaces of the light emitting structure and thesubstrate, wherein at least a portion of an upper surface of thesubstrate is exposed.

An exemplary embodiment of the present invention also discloses a methodof fabricating a light emitting device including: preparing a lightemitting structure on which a substrate is formed; and forming ananti-reflection layer covering side surfaces of the light emittingstructure and the substrate, wherein at least a portion of an uppersurface of the substrate is exposed.

An exemplary embodiment of the present invention also discloses a lightemitting device including: a substrate; a light emitting structureformed on one surface of the substrate; and a transflective portionformed on the other surface of the substrate, wherein the transflectiveportion may have a different index of refraction from that of thesubstrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1, 2, 3, and 4 are sectional views of an example of a lightemitting device according to an exemplary embodiment of the presentinvention, and a method of fabricating the same.

FIGS. 5, 6, and 7 are sectional views of an example of a light emittingdevice according to another exemplary embodiment of the presentinvention, and a method of fabricating the same.

FIG. 8 is a sectional view of an example of a light emitting deviceaccording to another exemplary embodiment of the present invention.

FIGS. 9, 10, and 11 are enlarged sectional views of Region A of FIG. 8for illustrating a transflective portion according to other exemplaryembodiments of the present invention.

FIGS. 12(a), 12(b), 13(a), 13(b), 14(a), 14(b), 15(a), 15(b), 16(a), and16(b) are sectional views and plan views of an example of a lightemitting diode according to an exemplary embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Hereinafter, exemplary embodiments of the disclosed technology will bedescribed in detail with reference to implementation examples, includingthose illustrated in the accompanying drawings. The following exemplaryembodiments are provided by way of examples so as to convey thedisclosed technology to those skilled in the art to which the presentinvention pertains. Accordingly, the present invention is not limited tothe exemplary embodiments disclosed herein and can be implemented indifferent forms. In the drawings, widths, lengths, thicknesses, and thelike of elements may be exaggerated for convenience and illustrativepurposes. Further, when an element is referred to as being “above” or“on” another element, it can be “directly above” or “directly on” theother element or intervening elements may be present. It will beunderstood that for the purposes of this disclosure, “at least one of X,Y, and Z” can be construed as X only, Y only, Z only, or any combinationof two or more items X, Y, and Z (e.g., XYZ, XYY, YZ, ZZ). Throughoutdrawings and corresponding description in the specification, likereference numerals denote like elements having the same or similarfunctions.

FIGS. 1 to 4 are sectional views of an exemplary of a light emittingdevice according to one embodiment of the disclosed technology and amethod of fabricating the same.

Referring to FIG. 1, a mask pattern 120 is formed on a light emittingdiode 100.

The light emitting diode 100 may include a light emitting structure 110and a substrate 21 disposed on the light emitting structure 110. Thelight emitting device may further include electrodes (not shown)disposed under the light emitting structure 110. Accordingly, the lightemitting structure 110 may be used as a wafer level package withoutpackaging. Any structure capable of emitting light with semiconductorlayers may be used as the light emitting structure 110 withoutlimitation, and the light emitting structure 110 may have, for example,a flip-chip structure or a vertical type structure. Next, one example ofthe light emitting diode 100 will be described with reference to FIGS.12 to 16. However, it should be understood that the disclosed technologyis not limited thereto, and a structure of the light emitting diode 100described below is provided to aid in comprehension of the disclosedtechnology.

FIGS. 12(a) to 16(b) are views showing a light emitting diode 100according to one exemplary embodiment of the present invention, and amethod of fabricating the same, where FIGS. 12(a), 13(a), 14(a), 15(a),and 16(a) are plan views, and FIGS. 12(b), 13(b), 14(b), 15(b), and16(b) are sectional views taken along line A-A shown in the plan views,respectively.

First, referring to FIGS. 12(a) and 12(b), a first conductive typesemiconductor layer 23 is formed on a substrate 21, and a plurality ofmesas M separated from each other are formed on the first conductivetype semiconductor layer 23. Each of the mesas M includes an activelayer 25 and a second conductive type semiconductor layer 27. The activelayer 25 is interposed between the first conductive type semiconductorlayer 23 and the second conductive type semiconductor layer 27. Areflective electrode 30 is disposed on each of the mesas M.

The mesas M may be formed by growing an epitaxial layer including thefirst conductive type semiconductor layer 23, the active layer 25, andthe second conductive type semiconductor layer 27, on the substrate 21by metal organic chemical vapor deposition (MOCVD), or the like,followed by patterning the second conductive type semiconductor layer 27and the active layer 25 to expose the first conductive typesemiconductor layer 23. Side surfaces of the mesas M may be obliquelyformed by photo-resist reflow or other techniques. An inclined profileof the side surfaces of the mesas M enhances extraction efficiency oflight generated in the active layer 25.

The mesas M may each have an elongated shape and extend parallel to eachother in one direction, as shown in FIG. 8. Such a shape simplifiesformation of the plural mesas M each having the same shape in aplurality of chip regions of the substrate 21.

However, it should be understood that the disclosed technology is notlimited thereto, and thus, instead of a plurality of mesas, a singlemesa may be formed. If the light emitting diode 100 includes a singlemesa, a region exposing the first conductive type semiconductor layer 23may be formed in other areas, except for a region of the mesa. Theregion exposing the first conductive type semiconductor layer 23 may beformed with various shapes, for example, one or more holes passingthrough the single mesa.

Although the reflective electrodes 30 may be formed on the respectivemesas M after formation of the mesas M, it should be understood that thedisclosed technology is not limited thereto. Alternatively, after thesecond conductive type semiconductor layer 27 is formed, the reflectiveelectrodes 30 may be formed on the second conductive type semiconductorlayer 27 before formation of the mesa M. The reflective electrodes 30cover most of an upper surface of the mesas M and have substantially thesame shape as that of the mesas M in plan view.

The reflective electrodes 30 include a reflective layer 28 and mayfurther include a barrier layer 29. The barrier layer 29 may cover anupper surface and side surfaces of the reflective layer 28. For example,a pattern of the reflective layer 28 is formed and then the barrierlayer 29 is formed thereon, whereby the barrier layer 29 may be formedto cover the upper surface and the side surfaces of the reflective layer28. By way of example, the reflective layer 28 may be formed bydepositing Ag, Ag alloys, Ni/Ag, NiZn/Ag, or TiO/Ag, followed bypatterning. The barrier layer 29 may be formed of, or include Ni, Cr,Ti, Pt, or a composite layer thereof, and prevents diffusion orcontamination of metallic material in the reflective layer.

After the mesas M are formed, an edge of the first conductive typesemiconductor layer 23 may also be subjected to etching. As a result, anupper surface of the substrate 21 may be exposed. A side surface of thefirst conductive type semiconductor layer 23 may also be formed at anangle.

As shown in FIG. 1, the mesas M may be restrictively disposed within anupper region of the first conductive type semiconductor layer 23. Thatis, the mesas M may be disposed in an island shape on the upper regionof the first conductive type semiconductor layer 23.

Referring to FIGS. 13(a) and 13(b), a lower insulation layer 31 isformed to cover the mesas M and the first conductive type semiconductorlayer 23. The lower insulation layer 31 has openings 31 a, 31 b inspecific regions thereof to allow electrical connection to the firstconductive type semiconductor layer 23 and the second conductive typesemiconductor layer 27. For example, the lower insulation layer 31 mayhave openings 31 a that expose the first conductive type semiconductorlayer 23 and openings 31 b that expose the reflective electrodes 30.

The openings 31 a may be disposed between the mesas M and near an edgeof the substrate 21, and may have an elongated shape extending along themesas M. In addition, the openings 31 b are restrictively disposed onthe mesas M to be biased to the same ends of the mesas.

The lower insulation layer 31 may be formed of, or include an oxide filmof SiO₂, a nitride film of SiN_(X), or an insulation film of MgF₂ bychemical vapor deposition (CVD), electron-beam evaporation, or the like.Although the lower insulation layer 31 may include a single layer, thelower insulation layer 31 may also include multiple layers. In addition,the lower insulation layer 31 may be formed of, or include a distributedBragg reflector (DBR), in which low and high index of refractionmaterial layers are alternately stacked one above another. For example,an insulation reflective layer having high reflectivity may be formed bystacking SiO₂/TiO₂ or SiO₂/Nb₂O₅ layers.

Referring to FIGS. 14(a) and 14(b), a current spreading layer 33 isformed on the lower insulation layer 31. The current spreading layer 33covers the mesas M and the first conductive type semiconductor layer 23.The current spreading layer 33 has openings 33 a disposed above therespective mesas M such that the reflective electrodes are exposedtherethrough. The current spreading layer 33 may form ohmic contact withthe first conductive type semiconductor layer 23 through the openings 31a of the lower insulation layer 31. The current spreading layer 33 isinsulated from the mesas M and the reflective electrodes 30 by the lowerinsulation layer 31.

The openings 33 a of the current spreading layer 33 have a larger areathan the openings 31 b of the lower insulation layer 31 so as to preventthe current spreading layer 33 from contacting the reflective electrodes30. Accordingly, sidewalls of the openings 33 a are disposed on thelower insulation layer 31.

The current spreading layer 33 is formed over a substantially overallupper area of the substrate 21 excluding the openings 33 a. Accordingly,current can be easily dispersed through the current spreading layer 33.The current spreading layer 33 may include a highly reflective metallayer, such as an Al layer, and the highly reflective metal layer may beformed on a bonding layer, such as Ti, Cr, Ni or the like. Further, aprotective layer having a monolayer or composite layer structure of Ni,Cr or Au may be formed on the highly reflective metal layer. The currentspreading layer 33 may have a multilayer structure of, for example,Ti/Al/Ti/Ni/Au.

Referring to FIGS. 15(a) and 15(b), an upper insulation layer 35 isformed on the current spreading layer 33. The upper insulation layer 35has openings 35 b that expose the reflective electrodes 30 together withan opening 35 a that exposes the current spreading layer 33. The opening35 a may have an elongated shape aligned in a direction perpendicular toa longitudinal direction of the mesas M, and may have a larger area thanthe openings 35 b. The openings 35 b expose the reflective electrodes 30exposed through the openings 33 a of the current spreading layer 33 andthe openings 31 b of the lower insulation layer 31. The openings 35 bmay have a smaller area than the openings 33 a of the current spreadinglayer 33 but a larger area than the openings 31 b of the lowerinsulation layer 31. Accordingly, sidewalls of the openings 33 a of thecurrent spreading layer 33 may be covered with the upper insulationlayer 35.

The upper insulation layer 35 may be formed using an oxide insulationlayer, a nitride insulation layer, or a polymer such as polyimide,Teflon, Parylene, or the like.

Referring to FIGS. 16(a) and 16(b), a first pad 37 a and a second pad 37b are formed on the upper insulation layer 35. The first pad 37 a isconnected to the current spreading layer 33 through the opening 35 a ofthe upper insulation layer 35, and the second pad 37 b is connected tothe reflective electrodes 30 through the openings 35 b of the upperinsulation layer 35. The first and second pads 37 a, 37 b may be used aspads for connection of bumps for mounting the light emitting diode on asub-mount, a package, or a printed circuit board, or pads for surfacemount technology (SMT).

The first and second pads 37 a, 37 b may be formed simultaneously by thesame process, for example, a photolithography and etching process or alift-off process. The first and second pads 37 a, 37 b may include abonding layer formed of, or include, for example, Ti, Cr, Ni, and thelike, and a high conductivity metal layer formed of, or include Al, Cu,Ag, Au, and the like.

Then, the substrate 21 is divided into individual light emitting diodechip units, thereby providing finished light emitting diode chips. Atthis time, the substrate 21 may be divided by scribing, such as laserscribing. If the substrate 21 is divided by laser scribing, a chamferedsurface may be formed at an upper corner of the substrate 21. Thechamfered surface may have an inclined side surface. Although not shownin FIG. 16(b), the chamfered surface 211 may be formed at an uppercorner of the substrate 21, as shown in FIG. 1.

Hereinafter, the structure of the light emitting diode 100 according tothe present exemplary embodiment will be described in detail withreference to FIGS. 16(a) and 16(b).

The light emitting diode may include the first conductive typesemiconductor layer 23, the mesas M, the reflective electrodes 30, thecurrent spreading layer 33, the substrate 21, the lower insulation layer31, the upper insulation layer 35, and the first and second pads 37 a,37 b.

The substrate 21 may be a growth substrate for growth of gallium nitrideepitaxial layers, for example, a sapphire substrate, a silicon carbidesubstrate, a silicon substrate, or a gallium nitride substrate. In thisembodiment, the substrate 21 may be a sapphire substrate.

The first conductive type semiconductor layer 23 is continuous, and theplural mesas M are disposed to be separated from each other on the firstconductive type semiconductor layer 23. As illustrated with reference toFIG. 12(b), the mesas M include the active layer 25 and the secondconductive type semiconductor 27 and have an elongated shape extendingtoward one side. Here, the mesas M are a laminate structure of galliumnitride compound semiconductor layers. As shown in FIG. 12(b), the mesasM may be restrictively disposed within the upper region of the firstconductive type semiconductor layer 23.

The first conductive type semiconductor layer 23, the active layer 25,and the second conductive type semiconductor layer 27 may includenitride semiconductors. The first and second conductive typesemiconductor layers 23, 27 may be n-type and p-type semiconductorlayers, respectively, or vice versa. The active layer 25 may include anitride semiconductor, and a peak wavelength of light emitted from theactive layer 25 may be determined by adjusting a composition ratio ofthe nitride semiconductor. Particularly, in this exemplary embodiment,the active layer 25 may emit light having a peak wavelength in a UVband.

The reflective electrodes 30 are respectively disposed on the mesas M toform ohmic contact with the second conductive type semiconductor layer27. As illustrated with reference to FIG. 1, the reflective electrodes300 may include the reflective layer 28 and the barrier layer 29, andthe barrier layer 29 may cover the upper surface and the side surfacesof the reflective layer 28.

The current spreading layer 33 covers the mesas M and the firstconductive type semiconductor layer 23. The current spreading layer 33has the openings 33 a disposed above the respective mesas M such thatthe reflective electrodes 30 are exposed therethrough. The currentspreading layer 33 also forms ohmic contact with the first conductivetype semiconductor layer 23 and is insulated from the plural mesas M.The current spreading layer 33 may include a reflective metal such asAl.

The current spreading layer 33 may be insulated from the mesas M by thelower insulation layer 31. For example, the lower insulation layer 31may be interposed between the mesas M and the current spreading layer 33to insulate the current spreading layer 33 from the mesas M. Inaddition, the lower insulation layer 31 may have the openings 31 bdisposed within the upper regions of the respective mesas M such thatthe reflective electrodes 30 are exposed therethrough, and the openings31 a that expose the first conductive type semiconductor layer 23therethrough. The current spreading layer 33 may be connected to thefirst conductive type semiconductor layer 23 through the openings 31 aof the lower insulation layer 31. The openings 31 b of the lowerinsulation layer 31 have a smaller area than the openings 33 a of thecurrent spreading layer 33, and are all exposed through the openings 33a.

The upper insulation layer 35 covers at least a portion of the currentspreading layer 33. The upper insulation layer 35 has the openings 35 bthat expose the reflective electrodes 30. In addition, the upperinsulation layer 35 may have the openings 35 a that expose the currentspreading layer 33. The upper insulation layer 35 may cover thesidewalls of the openings 33 a of the current spreading layer 33.

The first pad 37 a may be disposed on the current spreading layer 33and, for example, may be connected to the current spreading layer 33through the opening 35 a of the upper insulation layer 35. The secondpad 37 b is connected to the reflective electrodes 30 exposed throughthe openings 35 b.

According to the exemplary embodiments, the current spreading layer 33covers the mesas M and almost all regions of the first conductive typesemiconductor layer between the mesas M. Thus, the current spreadinglayer 33 may allow easy dispersion of current therethrough.

In addition, the current spreading layer 23 includes a reflective metallayer, such as Al, and the lower insulation layer is formed of, orincludes an insulation reflective layer, so that the current spreadinglayer 23 or the lower insulation layer 31 can reflect light that is notreflected by the reflective electrodes 30, thereby enhancing lightextraction efficiency.

Although the light emitting diode 100 illustrated above may be used inthe disclosed technology, the present invention is not limited thereto.

Referring to FIG. 1 again, a mask pattern 120 is formed on a substrate21. Accordingly, an upper surface of the substrate 21 is partiallyexposed through openings 121 of the mask pattern 120. The mask patternmay include a photoresist.

The substrate 21 may include a chamfered surface 211 formed at an uppercorner thereof. The chamfered surface 211 may be formed by scribingduring division of the substrate 21, without being limited thereto.Alternatively, the chamfered surface 211 may be formed by a separateetching process.

Then, referring to FIG. 2, a convex-concave pattern having protrusions215 and depressions 213 is formed on an upper surface of the substrate21.

The convex-concave pattern may be formed by etching using the maskpattern 120 as an etching mask, for example, by dry etching. As aresult, the upper surface of the substrate 21 under the openings 121 maybe etched to form the depressions 215. The depressions 215 may be formedin various shapes depending upon the shape of the mask pattern 120. Forexample, the depressions may have a V-shape having inclined sidesurfaces, as shown in FIG. 2.

In above description, the convex-concave pattern is illustrated as beingformed by a separate etching process. However, the convex-concavepattern may alternatively be formed simultaneously with division of thesubstrate 21 for formation of the light emitting diodes 100.Specifically, when the substrate 21 is divided by laser scribing, alaser beam is also applied to the upper surface of the substrate 21 inregions of the respective light emitting diodes 100, in addition toregions where the substrate 21 is divided. As a result, the depressions215 may be formed in the regions to which a laser beam is applied. Thedepressions 215 formed in the process of dividing the substrate 21 mayhave a V-shape, and the side surfaces of the depressions may have thesame inclination as that of the chamfered surface 211. Since thedepressions 215 of the convex-concave pattern are formed during divisionof the substrate into the light emitting diodes 100, etching for formingthe convex-concave pattern can be omitted, thereby simplifying thefabrication process.

Referring to FIGS. 3 and 4, an anti-reflection layer 130 is formed tocover side surfaces of the substrate 21 and side surfaces of the lightemitting structure 110, and to fill the depressions 215.

First, referring to FIG. 3, an anti-reflection material 130 a is formedto cover an upper surface and side surfaces of the substrate 21, sidesurfaces of the light emitting structure 110, and the mask pattern 120.

The anti-reflection material 130 a may have an index of refraction nthat is lower than that of the substrate 21 and higher than that of air(n_(air)=1). By way of example, the anti-reflection material 130 a mayinclude SiO₂ (nSiO₂=about 1.45), and further include at least one ofSiO₂, SiN_(X), SiON, MgF₂, MgO, Si₃N₄, Al₂O₃, SiO, TiO₂, Ta₂O₅, ZnS, CeOand CeO₂. The anti-reflection material 130 a may be formed by variousdeposition methods, in particular, by planetary electron beamevaporation. By virtue of planetary electron beam evaporation, theanti-reflection material 130 a can be easily formed on the side surfacesof the substrate 21 and the light emitting structure 110.

Then, referring to FIG. 4, the anti-reflection layer 130 is formed by alift-off process which removes the mask pattern 120 such that theanti-reflection material 130 a on the mask pattern 120 is removed. As aresult, the light emitting device as shown FIG. 4 is provided.

Although not shown, the light emitting device may further includeelectrodes formed on a lower surface of the light emitting structure110.

The anti-reflection layer 130 may cover the side surfaces of the lightemitting structure 110 and the substrate 21, and fill the depressions215. An upper surface of the protrusions 213 may be exposed. With thisconfiguration of the anti-reflection layer 130, the light emittingdevice can have a wide beam angle, which will be described in moredetail hereinafter.

The anti-reflection layer 130 may have an index of refraction which islower than that of the substrate 21 and higher than that of air, therebypreventing total internal reflection of the light emitting device. Byway of example, if the substrate 21 is a sapphire substrate(n_(sapphire)=about 1.77), light passing through the anti-reflectionlayer 130 has a larger critical angle of total reflection than lightemitted from the sapphire substrate directly into air.

Thus, the percentage of light emitted to a side surface of the lightemitting device is increased, thereby providing a wide beam angle.Further, since the anti-reflection layer 130 is formed only in thedepressions 215 on the upper surface of the substrate 21, light directedtowards the upper surface of the protrusions is more likely to besubjected to total reflection into the light emitting device such thatthe light is emitted to the side surface. In addition, since thedepressions 215 have inclined side surfaces, light emitted from thelight emitting device is more likely to be directed towards the sidesurface than in a vertical upward direction. Thus, the light emittingdevice according to the present exemplary embodiment can have a widebeam angle while emitting uniform light over an entire output angle oflight. In other words, illumination intensity can be maintainedsubstantially constant regardless of an output angle of light.

According to this exemplary embodiment, the light emitting device canhave a wide beam angle while emitting uniform light regardless of anoutput angle of light without an additional component. In particular, inthe case of manufacturing UV light emitting devices, to which lenses,which can be deformed or degraded by UV light, cannot be applied, thelight emitting device alone can achieve a wide beam angle, therebyproviding improved reliability.

FIGS. 5 to 7 are sectional views of a light emitting device according toanother exemplary embodiment, and a method of fabricating the same. Thesame features as those described in the previously-described exemplaryembodiments will not be described in detail here.

Referring to FIG. 5, a mask 140 is formed on a light emitting diode 100.The light emitting diode 100 includes a light emitting structure 110 onwhich a substrate 21 is formed.

The mask 140 may be formed to cover an upper surface of the substrate 21and include a photo-resist. A chamfered surface 211 may be exposedwithout being covered by the mask 140.

Referring to FIG. 6, an anti-reflection material 150 a is formed tocover the mask 140, side surfaces of the substrate 21, and side surfacesof the light emitting structure 110. The anti-reflection material 150 amay include at least one of SiO₂, SiN_(X), SiON, MgF₂, MgO, Si₃N₄,Al₂O₃, SiO, TiO₂, Ta₂O₅, ZnS, CeO and CeO₂, and be formed by planetaryelectron beam evaporation.

Referring to FIG. 7, the mask 140 and the anti-reflection material 150 aon the mask 140 are removed. As a result, the light emitting device asshown FIG. 7 is provided.

The light emitting device includes the light emitting structure 110, thesubstrate 21 disposed on the light emitting structure 110, and theanti-reflection layer 150 covering the side surfaces of the lightemitting structure 110 and the substrate 21, wherein the upper surfaceof the substrate 21 is exposed.

Accordingly, total reflection of light directed towards a side surfaceof the light emitting device is decreased, whereby the amount of lightemitted towards the side surface of the light emitting device can beincreased. Further, since the light is more likely to be subjected tototal reflection at an interface between the upper surface of thesubstrate 21 and air rather than at the side surface of the lightemitting device, a much greater percentage of light can be emitted tothe side surface. As a result, a beam angle of the light emitting devicecan be widened while maintaining substantially uniform illuminationintensity over an entire output angle of light.

FIG. 8 is a sectional view of a light emitting device according toanother embodiment of the disclosed technology, and FIGS. 9 to 11 areenlarged sectional views of a region A in FIG. 8 for illustrating atransflective portion according to another exemplary embodiment of thepresent invention.

The light emitting device includes a light emitting diode 100 and atransflective portion 300. The light emitting diode 100 includes asubstrate 21 and a light emitting structure 110.

The light emitting structure 110 is disposed on one surface of thesubstrate 21 and the transflective portion 300 is disposed on the othersurface of the substrate 21.

The light emitting diode 100 is a flip-chip type light emitting diodeand the light emitting device in this exemplary embodiment may includethe light emitting diode 100 described with reference to FIGS. 12(a) to16(b), similar to exemplary embodiments in FIGS. 1 to 4. Thus, the lightemitting device may include electrode pads 37 a, 37 b disposed under thelight emitting diode 100. The substrate 21 may be a growth substrate forgrowth of semiconductor layers, for example, a sapphire substrate or agallium nitride substrate. By way of example, the substrate 21 is aheterogeneous substrate suitable for growth of gallium nitridesemiconductor layers, and has a first index of refraction. For example,the substrate 21 may be a sapphire substrate having an index ofrefraction of about 1.78 at a wavelength of 450 nm, or a SiC substratehaving an index of refraction of about 2.72 at a wavelength of 450 nm.In the disclosed exemplary embodiments, the substrate 21 is a sapphiresubstrate. The substrate 21 has a thickness of 250 μm or less.

Detailed descriptions of features of the light emitting diode 100 areomitted.

The transflective portion 300 may be disposed on the substrate 21 andmay have a different index of refraction from that of the substrate 21.Hereinafter, the transflective portion 300 according to exemplaryembodiments will be described in more detail with reference to FIGS. 9to 11.

Referring to FIG. 9, the transflective portion 300 a may have a lowerindex of refraction than that of the substrate 21. For example, when thesubstrate 21 is a sapphire substrate, the transflective portion 300 amay have an index of refraction of less than 1.78. Since thetransflective portion 300 a has a lower index of refraction than that ofthe substrate 21, a light beam angle of the light emitting device iswidened by light which is totally reflected at an interface between thetransflective portion 300 a and the substrate 21. Although thetransflective portion 300 a is described as having a lower index ofrefraction than that of the substrate 21, it should be understood thatthe transflective portion may have a higher index of refraction thanthat of the substrate 21.

FIG. 10 is a view showing a region A in FIG. 8 according to anotherexemplary embodiment.

As shown in FIG. 10, the transflective portion 300 b is composed of atleast two layers. By way of example, the transflective portion 300 bincludes first to third layers 301 to 305. The first to third layers 301to 305 are formed of, or include different materials of SiN, SiO₂, TiO₂,HfO₂, and the like.

The first to third layers 301 to 305 have different indexes ofrefraction. For example, the first layer 301 has a lower index ofrefraction than that of the second layer 303 disposed on the first layer301, and the third layer 305 disposed on the second layer 303 has alower index of refraction than that of the second layer 303. Inaddition, the first layer may have a lower index of refraction than thatof the third layer 305, without being limited thereto. By way ofexample, the first layer 301 may be formed of, or include SiO₂, thesecond layer 303 may be formed of, or include TiO₂, and the third layer305 may be formed of, or include HfO₂.

Alternatively, the indexes of refraction of the first to third layersmay decrease with increasing distance from the substrate 21. Forexample, the first layer 301 may be formed of, or include TiO₂, thesecond layer 303 may be formed of, or include HfO₂, and the third layer305 may be formed of, or include SiO₂.

Alternatively, the indexes of refraction of the first to third layersmay increase with increasing distance from the substrate 21.

The light emitting device according to another exemplary embodiment canreflect a portion of light entering the light emitting device throughthe substrate 21 from a semiconductor laminate structure and transmitthe other portion of the light by the transflective portion 300 bcomposed of at least two layers, thereby increasing a light beam angle.

Further, the light emitting device may employ a thin substrate 21 havinga thickness of 250 μm or less, thereby minimizing light loss whileallowing slimness of the light emitting device.

In addition, the light emitting device chip is mounted directly on acircuit board by flip bonding or SMT (Surface Mount Technology), whichhas an advantage over typical package type light emitting devices interms of efficiency and reduction in size.

FIG. 11 is a view showing Region A in FIG. 8 according to yet anotherexemplary embodiment of the present invention.

The transflective portion 300 c has a different index of refraction fromthat of the substrate 21. The transflective portion 300 c transmits someof light and reflects the other of light. The transflective portion 300c may be formed of, or include a metallic material. Light transmittanceof the transflective portion 300 c may be controlled by adjusting thethickness thereof. The transflective portion 300 c is composed of a thinmetal film layer.

The light emitting device according to yet another exemplary embodimentcan reflect some of light entering the light emitting device through thesubstrate 21 from a semiconductor laminate structure and transmit theother of the light by virtue of the transflective portion 300 c composedof a thin metal film layer, thereby increasing a light beam angle.

Further, the disclosed technology employs a thin substrate 21 having athickness of 250 μm or less, thereby minimizing light loss whileallowing slimness of the light emitting device.

In addition, the light emitting device chip is mounted directly on acircuit board by flip bonding or SMT (Surface Mount Technology), whichhas an advantage over a typical package type light emitting devices interms of efficiency and reduction in size.

Implementations of the disclosed technology can be used to provide alight emitting device which includes an anti-reflection layer and asubstrate, an upper surface of which is at least partially exposed, aswell as a method of fabricating the same. Thus, a beam angle of thelight emitting device can be widened. Further, a light emitting devicewhich emits a substantially constant amount of light regardless of anoutput angle of light can be provided. Therefore The light emittingdevice having a wide beam angle can be provided without additionalcomponents. Thus, reliability of the light emitting device can beimproved.

Further, implementations of the disclosed technology can be used toprovide the light emitting device further including a light emittingstructure disposed on one surface of a substrate and a transflectiveportion disposed on the other surface of the substrate, wherein thetransflective portion has a different index of refraction from that ofthe substrate to reflect a portion of light emitted to the other surfaceof the substrate, thereby widening a light beam angle. The lightemitting device employs a thin substrate having a thickness of 250 μm orless while achieving a light beam angle of 140° or more, therebyminimizing light loss and having an advantage with respect to reductionin thickness thereof. Further, according to the present invention, alight emitting device chip is mounted directly on a circuit board byflip bonding or SMT (Surface Mount Technology), which has an advantageover a typical package type light emitting device in terms of highefficiency and reduction in size.

Various modifications and variations can be made to the exemplaryembodiments without departing from the spirit and scope of the appendedclaims of the present invention, and the present invention incorporatesall of the spirit and scope of the appended claims.

What is claimed is:
 1. A light emitting device comprising: a substrate;a light emitting structure disposed on one surface of the substrate; anda transflective portion disposed on the other surface of the substrate,wherein the transflective portion and the substrate have differentindexes of refraction from one another.
 2. The light emitting device ofclaim 1, wherein the transflective portion comprises a plurality oflayers having different indexes of refraction from one another.
 3. Thelight emitting device of claim 2, wherein the layers comprise differentlayers comprising at least two of SiN, SiO₂, TiO₂, and HfO₂.
 4. Thelight emitting device of claim 3, wherein the layers comprise first tothird layers, each of the first to third layers comprising any one ofSiN, SiO₂, TiO₂ and HfO₂, and the first to third layers comprisedifferent materials from one another.
 5. The light emitting device ofclaim 2, wherein the layers comprise first to third layers sequentiallystacked one above another, the first layer has a lower index ofrefraction than that of the second layer disposed on the first layer,and the third layer disposed on the second layer has a lower index ofrefraction than that of the second layer.
 6. The light emitting deviceof claim 2, wherein the layers comprise first to third layerssequentially stacked one above another, and the index of refraction isdecreased from the first layer to the third layer.
 7. The light emittingdevice of claim 2, wherein the layers comprise first to third layerssequentially stacked one above another, and the index of refraction isincreased from the first layer to the third layer.
 8. The light emittingdevice of claim 1, wherein the transflective portion comprises a thinmetal film layer.
 9. The light emitting device of claim 1, wherein thesubstrate has a thickness of 250 μm or less.